PCB LAMINATE AND PCB BOARD
[EIRI/EDPR/4546] J.C.: 2763XL
INTRODUCTION
PCB Stands for "Printed Circuit Board." A PCB is a thin board made of fiberglass, composite epoxy, or other laminate material. Conductive pathways are etched or "printed" onto board, connecting different components on the PCB, such as transistors, resistors, and integrated circuits.
In other words, A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate.
A PCB is a printed circuit board is used in electronics to build electronic devices. A PCB serves two purposes in the construction of an electronic device; it is a place to mount the components and it provides the means of electrical connection between the components.
There are four main parts to a PCB:
Substrate:
The first, and most important, is the substrate, usually made of fiberglass. Fiberglass is used because it provides a core strength to the PCB and helps resist breakage. Think of the substrate as the PCB’s “skeleton”.
Copper Layer:
Depending on the board type, this layer can either be copper foil or a full-on copper coating. Regardless of which approach is used, the point of the copper is still the same — to carry electrical signals to and from the PCB, much like your nervous system carries signals between your brain and your muscles.
Solder Mask:
The third piece of the PCB is the solder mask, which is a layer of polymer that helps protect the copper so that it doesn’t short-circuit from coming into contact with the environment. In this way, the solder mask acts as the PCB’s “skin”.
Silkscreen:
The final part of the circuit board is the silkscreen. The silkscreen is usually on the component side of the board used to show part numbers, logos, symbols switch settings, component reference and test points. The silkscreen can also be known as legend or nomenclature.
COST ESTIMATION
Plant Capacity 8000 Nos/Day
Land & Building (7200 sq.mt.) Rs. 35.00 Cr
Plant & Machinery Rs. 90.14 Cr
Working Capital for 1 Months Rs. 40.22 Cr
Total Capital Investment Rs. 165.63 Cr
Rate of Return 43%
Break Even Point 38%
CONTENTS
INTRODUCTION
FIG: DOUBLE SIDED PCB AFTER FINISHING COMPONENTS PLACEMENT
THERE ARE FOUR MAIN PARTS TO A PCB:
SUBSTRATE:
COPPER LAYER:
SOLDER MASK:
SILKSCREEN:
TYPES OF PCB
1. SINGLE-SIDED
ADVANTAGES OF SINGLE-SIDED PCBS INCLUDE:
2. DOUBLE-SIDED
USES AND APPLICATION
B.I.S. SPECIFICATION
THE INDIAN STANDARDS RELEVANT TO PCBS ARE:-
FOR MORE INFORMATION CONTACT AT:
TECHNOLOGY OF COPPER CLAD LAMINATE
FOR CCL TYPE, OFTEN ACCORDING TO DIFFERENT RULES, THERE ARE DIFFERENT CATEGORIES:
ACCORDING TO THE FLAME RETARDANT GRADE:
THE COMPOSITION OF CCL
CCL PERFORMANCE AND STANDARD
COSMETIC REQUIREMENTS
SIZE REQUIREMENT
ELECTRICAL PERFORMANCE REQUIREMENTS
PHYSICAL PERFORMANCE REQUIREMENTS
CHEMICAL PERFORMANCE REQUIREMENTS
ENVIRONMENTAL PERFORMANCE REQUIREMENTS
PREPARATION AND TEST METHOD OF CCL
TABLE TYPE SPECIFICATION AND MANUFACTURERS OF MAIN FACILITIES
TABLE PARAMETERS OF PTFE AND FEP EMULSIONS
TECHNOLOGICAL PROCESS
PROCESS FLOW DIAGRAM
GLASS FIBRE MAT PRE-TREATMENT
GLASS FIBRE MAT MODIFICATION
PTFE EMULSION PREPARATION
DIPPING
DRYING AT ROOM TEMPERATURE
DRYING IN AN OVEN
OBSERVATION AND WEIGHING
VACUUM HOT PRESSING
IMAGE AND MECHANICAL PRINCIPLE DIAGRAM OF VACUUM HOT PRESS
STRUCTURE OF SAMPLE IN HOT PRESS
MANUFACTURING PROCESS IN BRIEF OF CCL LAMINATE
PROCESS FLOW CHART
MANUFACTURING TECHNIQUE FOR PURE PTFE BOARD
PROCESS FLOW DIAGRAM OF CUTTING MOULDING
PADDING:
PREFORMING:
SINTERING:
CUTTING:
MANUFACTURING TECHNIQUE FOR PTFE WITH INORGANIC PADDING
PROCESS FLOW DIAGRAM OF ROLLING PROCESS
DIP CLOTH PRODUCTION PROCESS
DIP CLOTH PRODUCTION PROCESS
EFFECT OF IMMERSION DEPTH
SEQUENCES IN PCB MANUFACTURE
STEP 1 – THE DESIGN
STEP 2 – PRINTING THE DESIGN
STEP 3 – CREATING THE SUBSTRATE
STEP 4 – PRINTING THE INNER LAYERS
STEP 5 – ULTRAVIOLET LIGHT
STEP 6 – REMOVING UNWANTED COPPER
STEP 7 – INSPECTION
STEP 8 – LAMINATING THE LAYERS
STEP 9 – PRESSING THE LAYERS
STEP 10 – DRILLING
STEP 11 – PLATING
STEP 12 – OUTER LAYER IMAGING
STEP 13 – PLATING
STEP 14 – ETCHING
STEP 15 – SOLDER MASK APPLICATION
STEP 16 – SILKSCREENING
STEP 17 – SURFACE FINISH
STEP 18 – TESTING
MANUFACTURING PROCESS OF PCB
1. RAW MATERIALS
2. PANELIZATION
SOME GUIDELINES FOR PANELIZATION ARE SIMPLE FOR EXAMPLE WITH ROUTED PANELS:
BUT:
AS WITH ALL TECHNICAL SUBJECTS, EXCEPTIONS ABOUND FOR EXAMPLE:
THIS IS POSSIBLE WITH SOME RESTRICTIONS:
PANELIZATION OF PCBS
3. ETCHING
THE TWO PROCESSING METHODS USED TO PRODUCE A DOUBLE-SIDED PWB WITH PLATED THROUGH HOLES.
CHEMICAL ETCHING
PCBS IN PROCESS OF HAVING COPPER PATTERN PLATED, NOTICE THE BLUE DRY FILM RESIST
4. LAMINATION
5. DRILLING
6. EXPOSED CONDUCTOR PLATING & COATING
SOLDER RESIST
7. SCREENING
8. ASSEMBLY
THE COMPONENTS THAT ARE ASSEMBLED IN THE BOARD INCLUDE:
PCB WITH TEST CONNECTION PADS
AFTER THE BOARD HAS BEEN POPULATED IT MAY BE TESTED IN A VARIETY OF WAYS:
1. SURFACE MOUNT TECHNOLOGY
SURFACES MOUNT COMPONENTS INCLUDING RESISTORS, TRANSISTORS AND AN INTEGERATED CIRCUITS
ASSEMBLY TECHNIQUES
ADVANTAGES
THE MAIN ADVANTAGES OF SMT OVER THE OLDER THROUGH-HOLE TECHNIQUE ARE:
DISADVANTAGES
REWORK
2. THROUGH HOLE TECHNOLOGY
CHARACTERISTICS
9. TESTING
10. CUTTING INDIVIDUAL PCBS FROM THE PRODUCTION PANEL
11. FINAL INSPECTION
12. PROTECTION & PACKAGING
MARKET OVERVIEW OF PCB
INDIAN PCB (PRINTED CIRCUIT BOARD) MARKET: DRIVERS
BREAKUP BY PRODUCT TYPE:
BREAKUP BY APPLICATION:
BREAKUP BY LAYER:
BREAKUP BY SEGMENT:
BREAKUP BY LAMINATE TYPE:
BREAKUP BY MANUFACTURING TYPE:
STATE INSIGHTS:
COMPETITIVE LANDSCAPE:
SUPPLIERS OF PCB BOARD
SUPPLIERS OF PCB
SUPPLIERS OF RAW MATERIALS
SUPPLIERS OF COPPER CLAD GLASS EPOXY SHEET
SUPPLIERS OF COPPER FOIL
SUPPLIERS OF FIBRE GLASS EPOXY SHEET
SUPPLIERS OF SILK SCREEN
SUPPLIERS OF ETCHING CHEMICALS AND CLEANINGPCB CHEMICALS
SUPPLIERS OF PRINTING INK
SUPPLIERS OF BARE PCB BOARD
SUPPLIERS OF SOLDER PASTE
SUPPLIERS OF SURFACE MOUNTED DEVICES
SUPPLIERS OF PLANT AND MACHINERY
SUPPLIERS OF AUTOMATED PLOTTER
SUPPLIERS OF EXPOSURE SYSTEM
SUPPLIERS OF ETCHING CENTRE
SUPPLIERS OF CNC PCB DRILLING MACHINE
SUPPLIERS OF PCB CUTTING MACHINE
SUPPLIERS OF PCB CLEANING MACHINE
SUPPLIERS OF UV PCB CURRING MACHINE & SCREEN PRINTING MACHINE
SUPPLIERS OF DRY FILM LAMINATING MACHINE
SUPPLIERS OF COPPER PLATING MACHINE
SUPPLIERS OF PLATING THICKNESS GAUGE
SUPPLIERS OF PCB TESTING EQUIPMENT
SUPPLIERS OF PCB ASSEMBLING PLANT
SUPPLIERS OF AUTOMATIC OPTICAL INSPECTION EQUIPMENT
SUPPLIERS OF AUTOMATIC XRAY INSPECTION MACHINE
SUPPLIERS OF ELECTRICAL MEASURING INSTRUMENTS
SUPPLIERS OF AIR POLLUTION CONTROL EQUIPMENTS
SUPPLIERS OF AIR CONDITIONING EQUIPMENTS
SUPPLIERS OF PLATEFARM WEIGHING MACHINE
SUPPLIERS OF MATERIAL HANDLING EQUIPMENTS
SUPPLIERS OF FIRE FIGHTING EQUIPMENTS
APPENDIX – A:
01. PLANT ECONOMICS
02. LAND & BUILDING
03. PLANT AND MACHINERY
04. OTHER FIXED ASSESTS
05. FIXED CAPITAL
06. RAW MATERIAL
07. SALARY AND WAGES
08. UTILITIES AND OVERHEADS
09. TOTAL WORKING CAPITAL
10. TOTAL CAPITAL INVESTMENT
11. COST OF PRODUCTION
12. TURN OVER/ANNUM
13. BREAK EVEN POINT
14. RESOURCES FOR FINANCE
15. INSTALMENT PAYABLE IN 5 YEARS
16. DEPRECIATION CHART FOR 5 YEARS
17. PROFIT ANALYSIS FOR 5 YEARS
18. PROJECTED BALANCE SHEET FOR (5 YEARS)
